Electronic packaging, System integration, Technology development, Reliability

Chiplet assembly, hybrid bonding, Si interposer technologies, fan-out wafer-level packaging, cryogenic packaging, the integration of high-bandwidth memory, RF characterization, and packaging for 5G/6G applications are just a few examples of the services offered by Fraunhofer IZM. For over 30 years, the institute has been one of the world’s leading institutions for applied research and development of robust and reliable electronics and their system integration at the wafer, chip, and board levels.
At three locations (Berlin, Cottbus, and Dresden) more than 450 employees, working with state-of-the-art industrial equipment alongside partners from industry and academia, are developing technological solutions for the microelectronics of tomorrow.