TopLine
Copper-Core Solder Columns for AI Data Centers. Transfers Heat. CTE Mismatch.
Company profile
Solder Columns replaces Solder Balls for very large size GPU, CPO, Glass-Core Substrates for AI Data Centers. Columns are more reliable that Solder Balls. Excellent heat transport. Absorbs CTE mismatch.
Products and services
◦
◦
◦
◦
◦
◦
◦
Main exhibitor
factronix GmbH Systeme für die Elektronikfertigung
Contact
TopLine
95 Highway 22 W, Milledgeville, GA 31061, USA
Contact request