Thermal interface materials, anti-thermal propagation & copper clad laminate

Fujipoly is a leading supplier of SARCON^® thermal interface materials for demanding applications including automotive, high-performance computing, semiconductor machines, space and data/network communications. Our portfolio includes solid and dispensable TIMs in custom shapes and formulations. A wide range of thermal, mechanical and electrical properties is available, with thermal conductivities up to 15 W/m·K (insulating) and 40 W/m·K (electrically conductive). We also offer anti-thermal propagation solutions for EV battery packs, ZEBRA^® elastomeric connectors for LCD and electronic interconnections, and waveSTRATE^® high-frequency PCB laminate materials for RF mmWave applications. Backed by decades of Japanese manufacturing expertise, Fujipoly delivers innovative material solutions.