Equipment Manufacturing & Services for Microelectronics and Advanced Packaging

PacTech – Packaging Technologies, is a leading provider of laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.