Precision ultrasonic spray coating for complex wafer topographies
Ultrasonic spray is a simple, economical, and repeatable spray coating process for photoresist coatings in photolithography wet processes and protective polyimide films for wafer dicing, providing a practical alternative to spin coating for complex wafer topography. Sono-Tek coating systems enable fine control of flow rate, coating speed, solvent delivery, and deposition amount using an advanced layering technique. Low-velocity spray shaping defines the atomized spray into precise, controllable patterns, producing very thin film layers with uniform coating across complex substrate topography. Direct spray coating using ultrasonic technology is proven to be a reliable and effective lithography method for photoresist coating on 3D microstructures, resulting in reduced device failure.
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Sono-Tek
2012 Route 9W, Milton, NY 12547, USA
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