VIA electronic manufacture customized LTCC ceramic multilayer boards and packages suitable for sophisticated applications. Other materials like Al₂O₃ or glass are possible. Typically applications are in industrial, telecommunication, 5G, 6G, space, defense and scientific market. RF applications like  coupler, filter, amplifier, MMIC-packages, TR-modules or integrated antennas or antennas in package (AiP). Customized boards, testboards, packages and various options of interconnection like BGA, LGA, Leadframe, castellations are possible. Excellent thermal management with thermal vias for improved local heat dissipation.