AML manufactures Wafer Bonding systems with in-situ wafer alignment capabilities

AML designs and manufactures Wafer Bonding systems with in-situ alignment capabilities.

The AWB systems offer outstanding flexibility, enabling a wide range of bonding techniques to be carried out and are ideally-suited to process development.

The systems feature an optical wafer-to-wafer alignment system as standard, with the capability of 1µm accuracy.  All bonding process steps can be carried out sequentially within the bonding chamber, without exposure to air between stages:

• Wafers are held in separation, up to 30mm apart
• operation under vacuum or controlled atmosphere
• independent heating of upper/lower wafers, up to 560°C
• in-situ radical-activation or chemical treatment of bonding surfaces
• in-situ alignment, immediately prior to bonding
• bonding, with contact forces up to 40kN