TopLine
Copper-Core Solder Columns for AI Data Centers. Transfers Heat. CTE Mismatch.
Unternehmensprofil
Solder Columns replaces Solder Balls for very large size GPU, CPO, Glass-Core Substrates for AI Data Centers. Columns are more reliable that Solder Balls. Excellent heat transport. Absorbs CTE mismatch.
Produkt- und Dienstleistungsangebot
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Hauptaussteller
factronix GmbH Systeme für die Elektronikfertigung
Kontaktdaten
TopLine
95 Highway 22 W, Milledgeville, GA 31061, USA
Kontaktanfrage