Glint Materials
Experience Innovative Dry Adhesive Non-Slip Pad SurfCon®
Unternehmensprofil
Experience Innovative Dry Adhesive Non-Slip Pad SurfCon®
Established since 2014, Glint Materials is the first pioneering company developing and manufacturing high friction dry adhesive pads especially for semiconductor industry where requires precise substrate handling. Our unique technology provides the controllability of directional adhesion force.
For example, strong horizontal adhesion force but popping free when the substrate is separated from the pad.
Conventional substrate handling methods are limited to resolve chronic issues such as sliding, misalignment, contamination, and damages in the semiconductor and display industry.
SurfCon® is an innovative dry adhesive high friction pad solution which is inspired by precision polymer engineering and micro patterning technology.
Established since 2014, Glint Materials is the first pioneering company developing and manufacturing high friction dry adhesive pads especially for semiconductor industry where requires precise substrate handling. Our unique technology provides the controllability of directional adhesion force.
For example, strong horizontal adhesion force but popping free when the substrate is separated from the pad.
Conventional substrate handling methods are limited to resolve chronic issues such as sliding, misalignment, contamination, and damages in the semiconductor and display industry.
SurfCon® is an innovative dry adhesive high friction pad solution which is inspired by precision polymer engineering and micro patterning technology.
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Produkt- und Dienstleistungsangebot
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Kontaktdaten
Glint Materials
280-3 Saneop-ro, 155beon-gil, Suwon 16648, Südkorea
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