Weltleitmesse und Konferenz der Elektronik
12.-15. November 2024 | Messe München
12.-15. November 2024 | Messe München
Ausstellerverzeichnis
TOPLINE CORPORATION
CCGA, Superconducting Solder Column, Bonding wire, IC Chip Tray, Zero-Ohm Jumper
Unternehmensprofil
CCGA, Column Grid Array, Cryogenic Superconducting Solder Columns for AI and Quantum Computers. IC Chip Tray Carriers. Au, Cu and Aluminum Bonding Wire for IC and EV Batteries. Zero-Ohm PCB Jumpers. PCB Spacers. Ceramic IC packages. Flip Chips test die and wafers. Super large Daisy Chain heterogeneous BGA packages for AI/ML datacenters.
Produkt- und Dienstleistungsangebot
◦
◦
◦
◦
◦
◦
◦
◦
◦
Hauptaussteller
Kontaktdaten
TOPLINE CORPORATION
95 Highway 22 W, Milledgeville, GA 31061, USA
Kontaktanfrage