Boschman Technologies B.V. - Exhibitor details - electronica exhibitor directory

Boschman Technologies B.V.

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Company profile

Boschman: advanced packaging technology
Focus on Automotive and IOT packages

Package Development:
We research, design and prototype advanced packaging concepts. Together with you, we develop and assemble innovative, out of the box package solutions.

Assembly Services:
We manufacture products in quantities of 10 to a few hundred thousands using semi-or fully automatic processes. These parts can be used for full qualification purposes and low- to medium-volume production.

Equipment:
Boschman specializes in the development and supply of advanced transfer molding and Ag-sintering systems for electronic assembly industries across the globe.

Unique Technologies:
Film assisted molding
• Dynamic insert technologies
• Through Polymer Via

Product and service range

Applications

Contact

Stenograaf 3
6921 EX Duiven
Netherlands
SEMICON Europa

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