Boschman: advanced packaging technology
Focus on Automotive and IOT packages
We research, design and prototype advanced packaging concepts. Together with you, we develop and assemble innovative, out of the box package solutions.
We manufacture products in quantities of 10 to a few hundred thousands using semi-or fully automatic processes. These parts can be used for full qualification purposes and low- to medium-volume production.
Boschman specializes in the development and supply of advanced transfer molding and Ag-sintering systems for electronic assembly industries across the globe.
• Film assisted molding
• Dynamic insert technologies
• Through Polymer Via