ATV Technologie GmbH - Exhibitor details - electronica exhibitor directory

ATV Technologie GmbH

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Company profile

SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC,Flip Chip
SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION
SRO-TCB THERMO COMPRESSION BONDER:300°C,Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering
PEO-601/-604 QUARTZ TUBE FURNACE:Fast ramping, multipurpose,ultra-uniform,LPCVD,CNT/graphene,VCSEL/AlGaAs/Si oxidation,diffusion,high vacuum,H2,annealing,alloying,LTCC sintering,thick film paste firing,Polyimide backing,Poly Si,Epitaxy,Si3N4,LTO,P & N solid source diffusion
PHP-630 LTCC SINTERING PRESS,1100°C:Constrained LTCC sintering,hot LTCC/glass embossing
DIAMOND SCRIBERS:to 200 mm Si Wafers,Al2O3, glass,InPh, GaAs
IR CVD/ALD SYSTEM:1050°C,single wafer,fast temperature & pressure

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Contact

Johann-Sebastian-Bach-Str. 38
85591 Vaterstetten
Germany
P  +49 89 81063050-0
F  +49 89 81063050-99

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