Facts and background information on TRUMPF's semiconductor activities

Ditzingen, March 04, 2026 – Technologies for the semiconductor industry have become an important business area for TRUMPF, recently generating around one billion euros in sales. As a supplier of key technologies for leading factory equipment manufacturers in the chip industry, TRUMPF benefits from a market that is characterised by significant long-term growth potential. More than 2,500 employees work on technologies for the semiconductor industry. The high-tech company has subsidiaries in all leading countries in the semiconductor industry, including the USA, Japan, South Korea and Taiwan. TRUMPF produces manufacturing solutions for chip production at its locations in Ditzingen, Schramberg, Freiburg and Warsaw.

The semiconductor industry is one of the most technologically demanding industries in the world. TRUMPF supplies key technologies for this industry. With its highly reliable manufacturing solutions and global service network, TRUMPF aims to ensure that production facilities run smoothly around the clock, a crucial factor given the billions invested in chip factories.

From EUV lithography and advanced packaging to etching and coating processes, TRUMPF solutions make an important contribution to the innovation, performance and sustainability of global semiconductor production.

TRUMPF has been working with ASML in the field of extreme ultraviolet lithography (EUV) since 2005. TRUMPF supplies the high-performance lasers for ASML's lithography systems for exposing the smallest chip structures. In addition, TRUMPF offers generators that provide energy as the heart of plasma processes such as coating chips during manufacture. These generators are indispensable in the semiconductor industry and enable stable and controlled plasma processes, where even the slightest deviations would have a major impact on the quality of the chips.

TRUMPF lasers can also be used in numerous production steps in the manufacture of semiconductors. In advanced packaging, the connection and functional integration of individual chips, TRUMPF lasers deliver maximum precision in the production of tiny ‘through-glass vias’ (TGVs), which enable connections between the individual chips. Another example of this is wafer dicing. TRUMPF lasers separate wafers three times faster than conventional sawing methods.