Precision laser processing for SiC, wafers and semiconductor manufacturing.

Founded in 2005, Suzhou Delphi Laser Co., Ltd. is listed on the Shanghai Stock Exchange STAR Market (688170). With over 1,000 employees and 13 group entities, including overseas subsidiaries, Delphi Laser develops precision laser processing equipment and automation solutions for semiconductor, precision electronics and optical communications industries. Our capabilities include SiC and wafer cutting, dicing, scribing, marking, laser ablation and micromachining, as well as processing of ceramic substrates, PCBs and other advanced materials. We integrate laser process development, precision motion control, vision, automation and system integration from application development to volume production.