Finetech has been a global supplier of high-precision die bonding and micro-assembly equipment for over 30 years, serving semiconductor, photonics, and advanced packaging applications. We support customers from early feasibility and process development through to scalable, automated production.

Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, and hybrid bonding. This flexibility supports heterogeneous integration for optical transceivers, power devices, MEMS, RF, and quantum hardware. We also provide dedicated SMD rework solutions.