World's leading trade fair and conference for electronics
November 12-15, 2024 | Messe München
November 12-15, 2024 | Messe München
Exhibitor directory
Packaging and Assembly Equipment (21 exhibitors)
all | A | C | D | H | J | L | M | N | O | P | S
all
A
C
D
H
J
L
M
N
O
P
S
A
2069202 Yokneam, Israel
ADT is specialized in the development and manufacturing of systems and blades.
85591 Vaterstetten, Germany
ATV specializes in vacuum reflow soldering & thermal systems for semiconductors.
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C
6716 AH Ede, Netherlands
We are ready at booth C2.537 to provide our solutions for testing package ICs
99441 Magdala, Germany
Maximum Protection & Cleanroom Packaging: Efficient, Sustainable, Certified.
D
85551 Kirchheim bei München, Germany
Total solutions for dicing, grinding and polishing of semiconductor wafers
H
J
3001 Leuven, Belgium
Our booth number is C1358. Please stop by and discover how we can support you.
Newcastle NE6 1TW, Great Britain
Automatic tape & dry film lamination, metal lift-off & SiC CMP/wafer grind
L
44805 Bochum, Germany
The next generation laser wafer dicing technology with 100% yield.
81829 München, Germany
We make premium adhesive tapes & tools for semiconductor back-end production.
M
20132 Milano, Italy
Come, visit, challenge us to meet your requirements!
N
244000 Tong Ling, China
NEXTOOL is an integrated supplier of semiconductor Packaging Equipment.
O
Chester, NH 03036, USA
ONTOS activates surface for adhesion and direct bonding, and removes residues
P
82152 Krailling, Germany
PSG is a leading provider of advanced manufacturing laser equipment