HOREXS is experienced IC substrate manufacturer.

Horexs is a professional semiconductor packaging substrate manufacturer. It's Products are widely used in SiP/CSP/FCCSP/FCBGA/MEMS/Memory(eMMC/DDR/MicroSD/USB/UDP)/RF Module package.As well the other microelectronics Fingerprint and camera electronics etc.

HOREXS produce IC substrate since in 2009, has more than 15 years experience in package substrate production, With HOREXS technology(mSAP/Substrative/RCC), We can help customers reduce their substrate purchasing cost at the high quality and reliability guarantee.

Support:
2-10 layer(with blind/bury hole);
Coreless;
FCBGA, FCCSP, Memory(MicroSD, eMMC/DDR series/LPDDR), CSP, FCBOC, SiP, MEMS package substrate, as well as Sensors, Microelectronics such as fingerprint/Camera assembly PCB.
Welcome explore with AKEN for business cooperation.