35-year Taiwan connectors manufacturer, IPO in 2004 (stock# 3217.TWO). Current capital is USD $30m, and revenue is USD $100m in 2023.
HQ locates in Hsinchu (Taiwan) with 3+1 factories- Hsinchu, Kunshan, Suining (China) & Vietnam (constructing), total 50,000sqm. We are in-house vertical integration from design, tooling, stamping, plating, injection to auto-assembly (in ISO 5 Cleanroom). We have RBA 7.0 Silver, IATF 16949, Plating License, ISO 50001, 14064, 14067, 45001, 14001, 9001 & QC 080000 certificates.
We focus on fine-pitch, high-pin-count, SMT type, high-freqnency and high-speed connectors, and mainly used in AI PC, cloud computing, telecom, industry, military and consumer (mobile, wearable), automotive electronics. Also, customize micro stamping for semi-con packaging (OSAT field).