Megasonic enhanced wet processing for single wafer and batch applications.

ProSys is the leading specialist in megasonic enhanced processing for single wafer and batch applications.

We help customers improve processes such as:

• FEOL/BEOL cleaning
• Post-CMP-, Pre-Bond-, and Mask cleaning
• TSV/VIA cleaning
• Fragile MEMS cleaning: Gentle and highly efficient
• Resist Strip/Develop
• Metal Lift-Off
• Post-Dicing cleaning (Saw, Laser, Plasma)

Parameters of all ProSys systems are measured and controlled in real-time. Our MegPie™ is the industry standard for sub 20 nm cleaning in high volume device manufacturing thanks to an unmatched cleaning efficiency and uniformity.

Our direct batch systems run without active cooling and help increase cleaning efficiency, throughput, and reduce tool downtime.