S&P GmbH, service provider in SMD taping, project conception, component shaping.

With over 25 years of experience in the industry of packaging and ennoblement of electronic components, S&P Dienstleistungen in der Mikroelektronik GmbH is one of the leading service providers on the market and is eager to develop the technology of tomorrow today. With our existing certifications according to ISO9001 and IATF16949, we represent a demonstrably competent, reliable and cross-industry partner.

The range of our services includes:

SMD Taping, Project conception, 2D and 3D Lead Inspection, Selections, Device Programming, Laser Marking, Color Marking, Component drying and packaging, Carrier Tape conception, Cutting-Bending-Forming of Components, Adding suction aids (e.g. polyimide adhesive).