CCGA, Column Grid Array, Cryogenic Superconducting Solder Columns for AI and Quantum Computers. IC Chip Tray Carriers. Au, Cu and Aluminum Bonding Wire for IC and EV Batteries. Zero-Ohm PCB Jumpers. PCB Spacers. Ceramic IC packages. Flip Chips test die and wafers. Super large Daisy Chain heterogeneous BGA packages for AI/ML datacenters.