World's leading trade fair and conference for electronics
November 12-15, 2024 | Messe München
November 12-15, 2024 | Messe München
Exhibitor directory
TOPLINE CORPORATION
CCGA, Superconducting Solder Column, Bonding wire, IC Chip Tray, Zero-Ohm Jumper
Company profile
CCGA, Column Grid Array, Cryogenic Superconducting Solder Columns for AI and Quantum Computers. IC Chip Tray Carriers. Au, Cu and Aluminum Bonding Wire for IC and EV Batteries. Zero-Ohm PCB Jumpers. PCB Spacers. Ceramic IC packages. Flip Chips test die and wafers. Super large Daisy Chain heterogeneous BGA packages for AI/ML datacenters.
Products and services
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Main exhibitor
Contact
TOPLINE CORPORATION
95 Highway 22 W, Milledgeville, GA 31061, USA
Contact request