We supply Takatori tape/detape equipment, both atmospheric pressure and under vacuum, for both semiconductor wafers and large flat panels.  Vacuum wafer mounting, temporary bonding to substrates, taping inside the wafer edge.

Takatori wire saws for slicing of SiC ingots, slicing of ceramics, glass, metals and Takatori wafer grind/backgrind equipment for SiC wafer production.

Plus Gigamat CMP polish and custom design Slurry dispense systems for SiC wafer production, and Wafer thickness, Bow, warp for SiC and Silicon wafers.