Advanced 3D packaging and integration for next-generation systems

Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) is a leading center for 3D wafer-level system integration and advanced packaging. Operating a state-of-the-art 300 mm process line based on Cu Through-Silicon Via (TSV) technology, ASSID provides tailored development and manufacturing of complex 3D systems.
Its capabilities cover TSV formation, assembly, hybrid integration, and 3D stacking, enabling application-driven R&D as well as qualification and prototype production of advanced 3D system-in-packages. Key application areas include artificial intelligence, high-performance computing, quantum technologies, photonic integration, and edge sensor systems. ASSID supports industry partners in bringing next-generation heterogeneous integration concepts into practice.