Leader in high power heat dissipation materials and packaging devices.

Suzhou Bozhi Technology Co., Ltd. is a high-tech enterprise specializing in high-power semiconductor heat-sink materials and packaging substrate devices. We provide our customers with ceramic metallized substrates through advanced, green and stable surface treatment technologies. Besides, we have lauched new substrates for the next generation of packaging. Our products are widely applied to optoelectronic chips, communication chips, lasers, sensors, thermoelectric coolers, special parts for semiconductor equipmentand other high-power packaging categories.