209 exhibitors

showcase their products at
electronica virtual

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FLATPAQ

RRC power solutions GmbH

FLATPAQ

MiniBridge 1.27 mm for space-saving connections

ERNI Electronics GmbH & Co. KG

MiniBridge 1.27 mm for space-saving connections

PIN Photodiode, Proximity and RGBC-IR Sensors

Vishay Europe Sales GmbH c/o Vishay Electronic GmbH

PIN Photodiode, Proximity and RGBC-IR Sensors

Electronic Manufacturing Services (EMS)

Vignal Electronic & Wiring

Electronic Manufacturing Services (EMS)

Gas Sensing Solutions

Axetris AG

Gas Sensing Solutions

Wire Your Security Application for Success

Littelfuse, Inc.

Wire Your Security Application for Success

Fibocom LTE Cat 1 Module

Fibocom Wireless Inc.

Fibocom LTE Cat 1 Module

Viscom AOI - S3088 DT

Viscom AG

Viscom AOI - S3088 DT

Pressfit: solderless interconnect technology

AXON' Kabel GmbH

Pressfit: solderless interconnect technology

New Products From Hammond!

Hammond Manufacturing Co., Ltd.

New Products From Hammond!

IPv6-based mesh networking

Nordic Semiconductor

IPv6-based mesh networking

Digital viewer DRV-Z1

Vision Engineering Ltd.

Digital viewer DRV-Z1

On-device vision intelligence

Irida Labs S.A.

On-device vision intelligence

Nexperia CAN-FD ESD Protection Series: PESD2CANF

Nexperia

Nexperia CAN-FD ESD Protection Series: PESD2CANF

Film Capacitor

Sungho Electronics Corp.

Film Capacitor

Smart detection for smart driving

Samsung Semiconductor Europe GmbH

Smart detection for smart driving

Open Standard Module – Solder down modules

Standardization Group for Embedded Technologies e.V.

Open Standard Module – Solder down modules

Encoder Solutions for all your Needs

Broadcom Inc.

Encoder Solutions for all your Needs

MLCC(Multilayer Ceramic Capacitors)

Samsung Electro-Mechanics GmbH

MLCC(Multilayer Ceramic Capacitors)

High Strength Copper Foil for Li-Ion Batteries

JX Nippon Mining & Metals Corp.

High Strength Copper Foil for Li-Ion Batteries

Our ideas for next generation automotive applications

TDK Corporation

Our ideas for next generation automotive applications

Power Metal Plate™ WFM Current Sense Resistors

Vishay Europe Sales GmbH c/o Vishay Electronic GmbH

Power Metal Plate™ WFM Current Sense Resistors

High Speed & EMC Connectors

ept GmbH

High Speed & EMC Connectors

Reed Sensors and Level Sensors

PIC Proximity Instrumentation Controls Kontaktbauelemente GmbH

Reed Sensors and Level Sensors

Pyrotechnical Circuit Protection

Hirtenberger Automotive Safety GMbH & Co KG

Pyrotechnical Circuit Protection

Product Overview

Smiths Interconnect

Product Overview

The Quintessence – TQ Passion for Technology

EBV Elektronik GmbH & Co. KG

The Quintessence – TQ Passion for Technology

KIS.ME - Keep it simple. Manage everything.

RAFI Group

KIS.ME - Keep it simple. Manage everything.

Presentation Silicon Alps Cluster

Silicon Alps Cluster GmbH

Presentation Silicon Alps Cluster

Flexibile Arm+FPGA Processing in SMARC form factor

SECO S.p.A.

Flexibile Arm+FPGA Processing in SMARC form factor

Sensing Technologies and Sensor Solutions

Renesas Electronics Europe GmbH

Sensing Technologies and Sensor Solutions

HMI: Pioneering technology for autonomous driving

LEONHARD KURZ Stiftung & Co. KG

HMI: Pioneering technology for autonomous driving

Compact Oscilloscope Extreamly extendable

RIGOL Technologies EU GmbH

Compact Oscilloscope Extreamly extendable

RUTRONIK Analytics - BI & Analytics as a Service

Rutronik Elektronische Bauelemente GmbH

RUTRONIK Analytics - BI & Analytics as a Service

OE-A Roadmap Executive Summary, 8th ed. (2020)

OE-A (Organic and Printed Electronics Association) A working group within VDMA

OE-A Roadmap Executive Summary, 8th ed. (2020)

EE Times Europe - Magazine

Aspencore Media GmbH

EE Times Europe - Magazine

Electronic manufacturing services EMS

Cicor Group

Electronic manufacturing services EMS

OneTech Wiring & Assembling

OneTech Group

OneTech Wiring & Assembling

Kool Mµ Hƒ Powder Cores

Magnetics

Kool Mµ Hƒ Powder Cores

Embedded Computing Design Product of the Week

Embedded Computing Design

Embedded Computing Design Product of the Week

Package Substrate

Samsung Electro-Mechanics GmbH

Package Substrate

RECOM Mobility / customized solutions

RECOM Power GmbH

RECOM Mobility / customized solutions

Electronic Specifier: Product Magazine

Electronic Specifier

Electronic Specifier: Product Magazine

Embedded Systems

Elma Electronic AG

Embedded Systems

Smart production with no compromise on quality

Fideltronik

Smart production with no compromise on quality

TAIYO YUDEN's Smart Products

TAIYO YUDEN Co., Ltd.

TAIYO YUDEN's Smart Products

Nexperia NXS, NXB, LSF AutoSense Translators

Nexperia

Nexperia NXS, NXB, LSF AutoSense Translators

DATA MODUL - THE DISPLAY EXPERTS

DATA MODUL AG

DATA MODUL - THE DISPLAY EXPERTS

RF and Multipole Connection

E-valucon Inc

RF and Multipole Connection

Omni 3

ASH Technologies Ltd.

Omni 3

Exhibitor videos