CCGA - COLUMN GRID ARRAY. Solder Columns and Copper Pillars reduce CTE mismatch for high reliability IC packages.
Pitch 0.5mm to 1.27mm. Attachment to ceramic packages, organic substrates and directly to silicon die.
We also make DAISY CHAIN Test Components for CCGA, BGA, QFN, QFP and solderable spacers for PCB mounting.
Full range of bonding wire for IC packages: Au-Gold, Al-Aluminum, Ag-Silver and Cu-Copper bonding wire. 12um to 500um
For manual wire bonders or automatic.