We supply Takatori and Gigamat semiconductor products across Europe.
Takatori for Tape Lamination, vacuum lamination, Temporary Bonding of wafers to substrates, Solvent-free metal lift off, vacuum wafer mounting including Taiko
-Wafer Grinding for hard materials such as Silicon Carbide, Sapphire, Lithium Niobate/Tantalate -Production wire saws for slicing hard materials, we are the world leader for SiC slicing, but also ceramics, Quartz and many other materials
Gigamat applications are:
-Cost effective wafer polishing, particularly CMP of Silicon Carbide
-Wafer Thickness and shape measurement (Bow/Warp) in volume production or smaller development equipment. Any material, conducting or insulating, high or low resistivity, with a full range of measurement parameters