JTA Ltd. - Exhibitor details - electronica exhibitor directory

JTA Ltd.

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Takatori equipment for vacuum lamination on wafers, temporary bonding, solvent-free metal lift-off, vacuum wafer mounting, wafer grinding

Company profile

We supply Takatori and Gigamat semiconductor products across Europe.

Takatori for Tape Lamination, vacuum lamination, Temporary Bonding of wafers to substrates, Solvent-free metal lift off, vacuum wafer mounting including Taiko

-Wafer Grinding for hard materials such as Silicon Carbide, Sapphire, Lithium Niobate/Tantalate -Production wire saws for slicing hard materials, we are the world leader for SiC slicing, but also ceramics, Quartz and many other materials

Gigamat applications are:

-Cost effective wafer polishing, particularly CMP of Silicon Carbide

-Wafer Thickness and shape measurement (Bow/Warp) in volume production or smaller development equipment. Any material, conducting or insulating, high or low resistivity, with a full range of measurement parameters

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