AT&S, a global technology leader in high-end printed circuit boards, IC substrates, and electronic solutions, will present its latest technology offerings at electronica 2026 in Munich. Throughout the exhibition, visitors will have the opportunity to meet AT&S experts to discuss current challenges and future developments in the electronics industry.

At this year's event, AT&S will focus on three key topics shaping the future of electronics: artificial intelligence, embedding technologies, and advanced European manufacturing capabilities.
As AI applications continue to drive demand for more powerful computing infrastructure, AT&S enables next-generation electronics through advanced interconnect solutions, including high-performance IC substrates and sophisticated printed circuit board technologies. The company supports leading AI and high-performance computing applications where performance, miniaturization, and reliability are essential.

AT&S will also showcase its embedding capabilities, which integrate electronic components and functions directly into printed circuit boards and modules. These technologies can reduce system size, improve electrical performance, enhance reliability, and enable higher levels of integration. AT&S supports customers with solutions ranging from embedded components to highly integrated module designs for industrial, automotive, and computing applications.

Visitors can also learn more about AT&S's European manufacturing footprint. With leading-edge R&D and production activities in Austria, AT&S helps customers strengthen supply-chain resilience while gaining access to advanced electronics manufacturing expertise.

The AT&S team looks forward to discussing technology trends, development challenges, and future innovations with customers and partners at electronica 2026.

Meet us at Booth 311 | Hall A2
November 10-13, 2026 | Munich, Germany