Diamond Thermal Solutions for the Future of Electronics

Jiangsu Jingkun Technology Co., Ltd. specializes in the development and manufacturing of diamond-based metal composite materials for thermal management applications.

By combining the outstanding thermal conductivity of diamond with the advantages of metal materials, we provide high-performance diamond copper and diamond aluminum composites featuring excellent thermal conductivity, low thermal expansion, lightweight structure and high reliability.

Our products are widely used in semiconductor packaging, high-power electronics, AI computing, 5G communication, laser devices and power electronics. With advanced material technology and precision manufacturing capabilities, Jingkun Technology delivers reliable thermal solutions to support the development of next-generation electronic systems.