Aismalibar presence at Electronica 2024

1.1.  Electronica 2024

The world’s leading trade fair, Electronica, provides a comprehensive update on rapidly developing technology in all fields of electronics every two years. Leading companies present forward-looking innovations and use the trade fair to expand and maintain their global networks.

·  Dates: 12-15 November

·  Timing: Tue. to Thur.: 09:00–18:00 / Fri.: 09:00–15:00

·  Adress: Trade Fair Center Messe München. Am Messesee 2, 81829 Munich, Germany

·  Aismalibar Booth: Hall B1 ➡ Booth 543

1.2.  About Benmayor Group

Benmayor: A Legacy of Innovation in the Electronics and Jewelry Industry Since 1967

·  Founded in 1967 by Gabriel Benmayor, Benmayor started its journey in the machinery market for the jewelry industry. With a vision for expansion, the company soon entered the electronics sector through an international partnership, specializing in machinery essential for the production of printed circuit boards (PCBs). Over the years, the jewelry and electronics divisions took separate paths but continued to grow under the Benmayor S.A. umbrella.

·  In 1994, Eduardo Benmayor, son of the founder, joined the company, boosting its commercial and manufacturing areas. In 1995, Eduardo initiated the manufacturing of proprietary machinery for the PCB industry, developing automation systems for the beginning and end of production lines under the Techno System brand. Additionally, he incorporated high-tech machinery from represented brands to complement Benmayor’s product range.

·  In 1997, Benmayor expanded its operations into the PCB industry’s consumables market, importing FR4 from Taiwan. Demonstrating leadership in the sector, Benmayor later acquired Aismalibar s.a., thus expanding production of aluminum-based high thermal dissipation laminates, becoming a benchmark in Europe.

·  In 2021, Benmayor took another strategic step in its global trajectory by opening a high thermal dissipation laminate production plant in China, designed to meet the growing demand from clients in mainland China.

1.3.  About Aismalibar

Aismalibar, Thermal Management Solutions, Since 1934

Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high-end Copper and metal-clad laminates and Thermal Interface Materials. 

Aismalibar's expertise lies in offering the best solutions to reduce the operational temperature of printed circuit boards (PCB) and their components, ensuring both quality and reliability. At the production plant in Barcelona – a strategic technological hub – Aismalibar develops, manufactures, and markets the latest laminate advances to produce printed circuit boards to offer customers a global and personalized service guaranteed through their international subsidiaries.

Aismalibar's goal is to reduce the operating temperature of electronic components, thereby prolonging their operating life and optimizing performance. Furthermore, the materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. Since 2009, all the insulated metal substrates (IMS) have been ISO/TS 16949: 2009 certified, RoHS Compliant, and halogen-free. All materials have secured UL certification, among others, for the entire Aismalibar product range.

Aismalibar products are utilized in various technology market segments, such as LED lighting, telecommunications, automotive, renewable energies, home appliances, railway transport, aerospace, energy storage, and industrial management systems. The company has evolved to become an unquestionable global leader. Aismalibar is committed to ensuring reliability and service in electronics.

1.4.  Catalogue of Products at Electronica

Aismalibar has a wide range of thermal management solutions, but this year, it will focus on presenting the following new products:

1.4.1.  Family Thermal FR4

·  Bond Sheet Glass Reinforced

·  Bond Sheet Glass Free

·  Thin Lam

1.4.1.1  Product Description

Bond Sheet Glass Reinforced: This is a B-stage dielectric prepreg glass reinforced with high thermal conductivity. It is based on epoxy ceramic chemistry and intended for adequate bonding between multilayer circuits (PCBs) and metal heat spreaders. Its high dielectric strength and resistance to thermal shocks, combined with its high thermal conductivity, ensure effective heat dissipation in critical power circuitry.

Bond Sheet Glass Free: This is a B-stage thermally conductive dielectric prepreg glass-free. It is based on epoxy ceramic chemistry and intended for adequate bonding between multilayer circuits (PCB) and metal heat spreaders. Its high dielectric strength and resistance to thermal shocks, added to its high thermal conductivity, ensure effective heat dissipation in critical power PCBs.

Thin Lam: Double-sided Cu-clad thin laminate of thermal conductive polymeric glass reinforced prepreg is used to produce double-sided and multilayer PCBs. Thin Lam bonds to a metal heat sink using standard multilayer lamination processes with one piece of B-stage COBRITHERM Bond Sheet. Its high dielectric strength, resistance to thermal shocks, and high thermal conductivity ensure effective heat dissipation in critical power circuitry.

1.4.2.  Family IMS: Metal Clad

·  Cobritherm HTC

·  Cobritherm HTC Ultrathin

·  Flextherm

·  Fastherm

·  IMS 5W & 8W/mK

1.4.2.1  Product Description

Cobritherm HTC: Insulated Metal Substrate (IMS), based aluminum clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity and high dielectric strength allows us to guarantee thermal dissipation from electronic components to the aluminum base in fast and efficient way. High MOT values guaranty the reliability of the laminate. The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the isolation in between the copper and aluminum layers under high voltage. Ideal for power moduls, IGBTS and automotive power train.

Cobritherm HTC Ultrathin: Insulated Metal Substrate (IMS), based aluminum clad with ED copper foil on the opposite side. It is designed to reliably dissipate circuitry thermally. A proprietarily formulated polymer-ceramic ultra-thin bonding layer with high thermal conductivity and dielectric strength allows us to guarantee thermal endurance. The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the isolation between the copper and aluminum layers under high voltage. Ideal for automotive headlights, the best thermal performance complies with automotive reliability tests.

Flextherm: is a high-technology thermal insulated metal substrate designed to produce conformable metal printed circuit boards. Its low thermal impedance allows temperature dissipation from the heating elements of a PCB into FLEXTHERM’s metal core at a highly efficient rate. FLEXTHERM is ideal for conformable MPCB manufacturing. It can be bent after MPCB production while maintaining the initial dielectric strength between conductive layers (Al and Cu).

Fastherm: Insulated Metal Substrate (IMS), based copper clad with RA copper foil on one side. It is designed for reliable thermal dissipation of circuitry. FASTHERM Cu-Cu is ideal for pedestal copper grow on PCBs. Due to its special dielectric layer Fastherm can be used for conformable MPCB manufacturing. It can be bent after MPCB production while maintaining the initial dielectric strength in between conductive layers.

IMS 5W & 8W/mK: Insulated Metal Substrate (IMS), based aluminum clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. A proprietarily formulated polymer-ceramic ultrathin bonding layer with high Tg and low CTE achieves excellent endurance and high MOT values. Laminate is supplied with a film on the aluminum side to protect it against wet PCB processes. The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the isolation in between the copper and aluminum layers under high voltage. It is ideal for automotive headlights, has the best thermal performance, and complies with automotive reliability tests.

1.4.3.  Family, Thermal Interface Material: TIM

·  Bond Sheet Cured Glass Reinforced

·  Bond Sheet Cured Glass Free

·  Air Gap Filler

·  Thermal Tape

·  Cobrithem ALP

1.4.3.1  Product Description:

Bond Sheet Cured Glass Reinforced: Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry and intended for improving thermal contact between two surfaces. Its high dielectric resistance, added to its high thermal conductivity, assures heat dissipation in critical power circuitry, assuring high dielectric strength. Ideal for thermal insulating material, less adhesive, easy to assemble on PCBA, and excellent dielectric performance.

Bond Sheet Cured Glass Free: Is a glass-free dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. An ultra-thin dielectric layer with high dielectric strength, high thermal conductivity, and low thermal resistance efficiently dissipates the heat generated by the power components into the cooling elements.

Air Gap Filler: Specialized coating designed to adapt seamlessly to varying surface textures. Air Gap Filler becomes highly malleable upon exposure to temperatures between 35°C and 40°C, allowing it to conform perfectly to the micro-textures and irregularities of the surfaces it encounters. As a result, it effectively fills microscopic air cavities that would otherwise create inefficiencies in thermal transfer. AIR GAP FILLER is ideal for industries requiring efficient thermal management, such as automotive, telecommunications, and consumer electronics.

Thermal Tape: That film features a double-sided adhesive and thermal transmission properties based on acrylic resin and PSA (pressure-sensitive adhesive). Its dual-core technology ensures excellent adhesion over time, making it ideal for improving wetting between rough surfaces. It allows the material to conform to the surface, providing strong anchoring and excellent thermal transmission.

Cobrithem ALP: Made from an Aluminium base coated with a dielectric ceramic layer, with extra low thermal resistance and high dielectric strength up to 6KV. It is ideal for building battery housing, covers, partitions or radiators, power electronics and comfortable heat sinks, among other solutions. It is insulated and guarantees excellent contact between the battery and dissipation elements.