YES manufactures precision Cleaning, Coating and Curing, as well as Wet Process equipment for innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging.

*  CLEAN:
Three series of YES Clean Systems for gentle surface cleaning, decontamination, surface activation, descum and photoresist strip using downstream plasma.

*  COAT:
Surface modification at the nanoscale by applying monolayer coatings to induce hydrophobic or hydrophilic properties. Variety of substrates and 100+ Silane precursors.

*  CURE:
Polyimide, BCB or PBO cure as well as Vacuum anneal up to 400°C using thermal and chemical processes.

*  BOND:
Low-temp direct bonding and high-temp vacuum annealing.

*  REFLOW:
Advanced packaging reflow applications, like Fluxless Formic Acid Reflow.

*  WET PROCESS:
Flexible, configurable, automated and manual wet process platforms for wafers and panels.