The next generation laser wafer dicing technology with 100% yield.

Here at LIDROTEC, we stand for quality, innovation and precision. We build laser dicing machines to cut microchips for the semiconductor industry. Our technology reduces the damage rate in the cutting process to virtually 0% (current waste rate is up to 10%). Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser. Semiconductor manufacturers that use our cutting-edge technology will save costs and increase both productivity and their sales potential. LIDROTEC builds laser dicing machines. The unique innovation is the use of a liquid stream to cool and rinse the wafers while they are cut with the laser. This increases yield and throughput.