World's leading trade fair and conference for electronics
November 15-18, 2022 | Messe München
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Packaging and Assembly Equipment (13 exhibitors)

 
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A
ACCRETECH (Europe) GmbH
81241 München, Germany
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MKS Atotech
10553 Berlin, Germany
Atotech, a brand within the Materials Solutions Division of MKS Instruments.
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ATV Technologie GmbH
85591 Vaterstetten, Germany
Quartz Tube Furnaces and Reflow Soldering Equipment under different atmospheres.
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D
DISCO HI-TEC EUROPE GmbH
85551 Kirchheim bei München, Germany
Total solutions for dicing, grinding and polishing of semiconductor wafers
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F
Furukawa Electric Europe Ltd.
London W6 8AH, Great Britain
UV Tape is adhesive tape for semiconductor process.
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H
Heidelberg Instruments Mikrotechnik GmbH
69123 Heidelberg, Germany
Maskless laser lithography systems for micro- and nanofabrication
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J
JTA Equipment Technology
Newcastle upon Tyne NE6 1TW, Great Britain
Photoresist lamination specialists, wafer mounting, temporary bonding, lift off
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O
ONTOS Equipment Systems
Chester, NH 03036, USA
ONTOS activates surface for adhesion and direct bonding, and removes residues
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S
S-CUBED
Montville, NJ 07045-0365, USA
Higher Throughput in Smaller Footprint.
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SET

SET

74490 Saint-Jeoire, France
World leading supplier of Flip-Chip Bonders excelling in high-end applications.
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Siconnex
5322 Salzburg/Hof, Austria
Global equipment manufacturer for wet chemistry equipment.
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T
Technic France
93212 Saint Denis La Plaine Cedex, France
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U
UniTemp GmbH
85276 Pfaffenhofen, Germany
UniTemp GmbH - we are a supplier for semiconductor equipment for the R&D area
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