Packaging and Assembly Equipment (13 exhibitors)
all | A | D | F | H | J | O | S | T | U
10553 Berlin, Germany
Atotech, a brand within the Materials Solutions Division of MKS Instruments.
85591 Vaterstetten, Germany
Quartz Tube Furnaces and Reflow Soldering Equipment under different atmospheres.
85551 Kirchheim bei München, Germany
Total solutions for dicing, grinding and polishing of semiconductor wafers
London W6 8AH, Great Britain
UV Tape is adhesive tape for semiconductor process.
69123 Heidelberg, Germany
Maskless laser lithography systems for micro- and nanofabrication
Newcastle upon Tyne NE6 1TW, Great Britain
Photoresist lamination specialists, wafer mounting, temporary bonding, lift off
Chester, NH 03036, USA
ONTOS activates surface for adhesion and direct bonding, and removes residues
Montville, NJ 07045-0365, USA
Higher Throughput in Smaller Footprint.
74490 Saint-Jeoire, France
World leading supplier of Flip-Chip Bonders excelling in high-end applications.
5322 Salzburg/Hof, Austria
Global equipment manufacturer for wet chemistry equipment.
93212 Saint Denis La Plaine Cedex, France
85276 Pfaffenhofen, Germany
UniTemp GmbH - we are a supplier for semiconductor equipment for the R&D area
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