CCGA Column Grid Array high reliability FPGA & ASIC for Aerospace and Defense Industry.
Zero ohm jumpers inside semiconductor packages: SOT, SOD, SOIC, SOP, TSSOP, QFN, QFP, BGA. Use for re-designing, bridging and routing PC Boards.
IC Bonding Fine-Wire for bonding machines: Gold 4N, bumping, aluminum, silver and copper. Also high-current bonding batteries.
IC JEDEC TRAYS: Standard and custom for BGA, QFN, QFP, SOIC, SOP, TSSOP.
IC Chip Tray - Waffle Packs for tiny components, MEMS, die and chips. 2-Inch and 4-Inch. Off the shelf. Available in small quantities.