Takatori are specialists in advanced tape lamination and delamination for back grind and the most demanding thin wafer applications including Taiko detape/mount and thin wafers below 50 microns. We are experts in thin wafer handling. Our New automatic tape roll changing allows extended operation without operator involvement.
We offer Dry resist lamination tools, both vacuum and atmospheric, for tenting and conformal/via fill application, also Tape-based Metal lift-off with a solvent free process that allows maximum reclaim of expensive metals such as Gold.
We have wafer mounting and remounting systems in production use, with and without expansion, with no die loss.