Factronix is specialized since over 15 year in reclaiming of electronic components. The unique high precision recovery process, developped by RETRONIX Ltd., provides a solution to many industry and customer problems including obsolescence, allocation, long lead times, e-waste and component shortage.  Components are desoldered under minimized heat, BGAs will be laser reballed. Alloy conversion can be applied if required. After testing components for solderability or function, parts will be packed to tape or tray to returning them into automized manufacturing process.

All process steps are fully automized and certified even for high reliability applications.

Factronix also delivers IC packaging like JEDEC trays or waffle packs, bond wire, zero-ohm-jumpers, open IC cavities and many more.