World's leading trade fair and conference for electronics
November 15-18, 2022 | Messe München
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TopLine Corporation

TopLine Corporation
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CCGA | Solder Columns | IC Bonding Wire | Zero Ohm Jumpers | IC JEDEC Trays

Company profile

CCGA Column Grid Array high reliability FPGA & ASIC for Aerospace and Defense Industry.

Zero ohm jumpers inside semiconductor packages: SOT, SOD, SOIC, SOP, TSSOP, QFN, QFP, BGA. Use for re-designing, bridging and routing PC Boards.

IC Bonding Fine-Wire for bonding machines: Gold 4N, bumping, aluminum, silver and copper. Also high-current bonding batteries.

IC JEDEC TRAYS: Standard and custom for BGA, QFN, QFP, SOIC, SOP, TSSOP.

IC Chip Tray - Waffle Packs for tiny components, MEMS, die and chips. 2-Inch and 4-Inch. Off the shelf. Available in small quantities.

Main Topic

Product presentations

Bonding Wires by TANAKA

Bonding Wires by TANAKA

Zero Ohm Jumpers (SMD)

Zero Ohm Jumpers (SMD)

IC JEDEC TRAYS & WAFFLE PACKS

IC JEDEC TRAYS & WAFFLE PACKS

Main exhibitor

Contact

TopLine Corporation
95 Highway 22 W, Milledgeville, GA 31061, USA
Contact request