World's leading trade fair and conference for electronics
November 15-18, 2022 | Messe München
November 15-18, 2022 | Messe München
Exhibitor portal
CCGA | Solder Columns | IC Bonding Wire | Zero Ohm Jumpers | IC JEDEC Trays
Company profile
CCGA Column Grid Array high reliability FPGA & ASIC for Aerospace and Defense Industry.
Zero ohm jumpers inside semiconductor packages: SOT, SOD, SOIC, SOP, TSSOP, QFN, QFP, BGA. Use for re-designing, bridging and routing PC Boards.
IC Bonding Fine-Wire for bonding machines: Gold 4N, bumping, aluminum, silver and copper. Also high-current bonding batteries.
IC JEDEC TRAYS: Standard and custom for BGA, QFN, QFP, SOIC, SOP, TSSOP.
IC Chip Tray - Waffle Packs for tiny components, MEMS, die and chips. 2-Inch and 4-Inch. Off the shelf. Available in small quantities.
Main Topic
TopLine
TopLine manufactures Daisy Chain test components, zero ohm PCB jumpers and engineering evaluation kits for experimentation. We make vibration dampers to extend the life of PCB assemblies and CCGA Column Grid Array to reduce stress caused by extreme thermal CTE mismatch.
Product presentations
Bonding Wires by TANAKA
Zero Ohm Jumpers (SMD)
IC JEDEC TRAYS & WAFFLE PACKS
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Products and services
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Main exhibitor
factronix GmbH Systeme für die Elektronikfertigung
Contact
TopLine Corporation
Contact request