USA/European distributor for the Takatori back-end packaging and SiC processing solutions, tape and dry film lamination, solvent free metal lift off. Our Automated systems give improved uptime and lower consumable costs for 24/7 manufacturing operations.

Recent enhancements in “tapeless detape” lowers COO and the 5-roll “auto tape-change” feature reduces resupply time and gives 36 hours of non stop production capability.

Automated dry-film resist application is available in vacuum and atmospheric processes for conformal or tenting lamination up to 300mm wafer diameter.

The SiC-focused grinder supports substrate manufacturing and wafer thinning and the auto wheel-change and auto-dressing features significantly improve tool availability.

Gigamat provides SiC CMP and wafer sorters.