Weltleitmesse und Konferenz der Elektronik
15.-18. November 2022 | Messe München
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TDM by Insidix offers state of the art deformation or warpage measurement system while devices under evaluation are experiencing thermal stress. The technology uses phase shifting Projection Moiré, advanced 3D sensors, and temperature chambers that can withstand temperatures between -65°C to 400°C.  Systems meet and surpass all deformation measurement standards for temperature cycling, moisture/reflow, coplanarity testing, warpage test methods, among others.
The systems are ideal for research development, quality and reliability, process development, and failure analysis studies. Present in semiconductor, medical, automotive, aerospace, and electronics industries. Latest advancements in 3D analysis and Projection Moiré have evolved into nanoscale detectability.