Weltleitmesse und Konferenz der Elektronik
15.-18. November 2022 | Messe München
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Perfection in printed circuits (HI TECH, HIGH MIX, LOW VOLUME, QUICK TURNAROUND)

Unternehmensprofil

More than 30 years experience in production of PWB, ML up to 30 layers, dim. 640x550x6,4, high Cu thickness, SBU, HDI, LDI, Cu via filling, controlled impedance, ENIPIG

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