ISO9001/TS16949 & AECQ facility for maufacture of Semiconductor Components.
Wafer foundry & in house Assembly and Test facilities (ATMP OSAT facility) for leaded and surface mount packages.
Having full capability for OSAT work of Silicon and Silicon Carbide Assembly and Test in TO220, TO247, TO252, SMB packages.
Transistors, Diodes, SCR and Triacs etc. in TO92, TO126, SOT23, TO220, TO220F, TO247, SMA, SMB and TO252 (DPAK) are some of the packages.
Complete Reilability testing facilities including HAST. Temp Cycling, Burn-in etc. capable to test and certify AECQ level.
MIL & JAN spec capability available.
Looking for strategic alliance partners for using our OSAT facility for Silicon & Silicon Carbide products.